ABSTRACT REVIEWED PAPERS
CALL FOR ABSTRACT REVIEWED PAPERS
On behalf of the technical program committee of the 2017 IEEE Symposium on Electromagnetic Compatibility and Signal and Power Integrity (EMC+SIPI 2017) and embedded conference on Signal and Power Integrity (SIPI 2017), we would like to introduce a new and exciting technical-program element for EMC+SIPI engineers and researchers: Abstract Reviewed Papers. Abstract Reviewed Papers can provide unique opportunities to socialize among EMC+SIPI engineers and researchers within the renowned IEEE conference environment and to exchange experiences and ideas. We firmly believe that this special program will help us build a professional community that benefits not only the development of the technologies but also the members’ professional careers. We also hope that this special program will lead us to reduce ever increasing gaps between rapidly changing modern electronic industry, computational analyses and traditional IEEE conferences.
To accommodate the busy schedule of practitioner engineers, only an abstract is required for the initial submission for Abstract Reviewed Papers. Upon acceptance, the final manuscript must follow the regular IEEE EMC paper format. Abstract Reviewed Papers are treated the same as regular papers in the conference proceedings, however, due to the differences in the reviewing processes, Abstract Reviewed Papers are not published in the IEEE Xplore. Abstract Reviewed Papers will have separate best paper awards. If scheduling conflicts arise, regular IEEE EMC papers will have scheduling priority over Abstract Reviewed Papers.
We invite you to be part of this new technical community and Inspire, Envision and Innovate in Washington D.C., the historic Capital of the USA.
PAPER TOPICS OF INTEREST
Topics include and are not limited to the following technical areas:
High-speed link/parallel bus/memory interface design
• Serial link design and performance analysis
• Parallel bus design and analysis in on-board or system-in-package
• Various memory interface design and analysis
• Advanced on-chip or 2.5D/3D signal interface design and analysis
• Transceiver or driver modeling including IBIS
• Signaling analysis including equalization and coding
Jitter and Noise Modeling, Analysis, and Mitigation
• BER analysis, modeling, and measurement
• Jitter and noise modeling and measurement techniques
• Jitter decomposition techniques
• Jitter and noise sensitivity modeling and analysis
• Crosstalk modeling and mitigation
Aeronautics and Space EMC
• EMC analysis, design and performance
System-In-Package (SiP) Including 2.5D and 3D Integrations, Exotic ICs and Emerging Technologies
• 3D IC and TSV modeling and analysis
• Timing models and closure in SiP
• Special numerical techniques for 3D integration
Passive Channel Component Modeling and Measurement Techniques
• De-embedding techniques
• High-frequency measurement techniques and models
• Interconnect design and optimization
• Material characterization and modeling
• Frequency and time domain measurement techniques
• Die/package/board SI/PI co-design
Numerical Modeling and Simulation Techniques for Interconnects
• High-frequency and broadband modeling techniques
• Causality and passivity detection and enforcement algorithms
• Measurement and modeling correlation
• Electrical and thermal co-simulation techniques
• Numerical modeling approaches and results for complex environments
Power Integrity Analysis and Power Distribution Network (PDN) Design
• System-level PDN modeling and design
• On-chip and off-chip PDN design and analysis
• On-chip and off-chip regulator modeling and performance analysis
• SI/PI co-optimization and design
EMI Measurements and Modeling
• EM interference control, measurements, and modeling
• PCB/connector/cable design for EM emission mitigation
ESD and Immunity
• System-level ESD
• IC/component immunity
• High-power electromagnetics
• RF Interference
• Wireless coexistence
• MIMO testing
• Innovative components
All other EMC Topics
AUTHOR SUBMISSION SCHEDULE
• Abstract: November 1, 2016 to February 21, 2017
• Acceptance Notification: March 27, 2017
• Final paper Material Due: May 3, 2017
ABSTRACT AND PAPER FORMATS
• Abstract proposal; initial paper proposal of approximately 500 words describing the paper proposal
• Traditional Oral presentation; presentation for those interested in large groups with limited potential for interactions with attendees. Six-page paper maximum, 20-minute presentation with a 10-minute question and answer session
• Open Forum; presentation for those interested in direct interaction with individuals or small groups
GUIDELINES FOR AUTHORS & SUBMITTAL PROCEDURES
• Prospective authors must submit electronically
• An abstract with approximately 500 words describing paper concept and results
• Choice of presentation format (traditional oral or open forum)
** During the electronic submission process, a unique author code will be created for tracking purposes. After abstract is accepted, further instructions on final paper submission will be provided.
Submissions are reviewed anonymously, so please do not include author names or affiliations on the ABSTRACT. Failure to comply with submission requirements may result in rejection.
PAPER ACCEPTANCE CRITERIA
• Importance of Topic; does it directly relate to the EMC+SIPI community?
• Technical Sophistication and Depth; does it present significant information, contribution, advancement, application or refinement of the state of the art? Does it bring the reader to a higher level of knowledge than is currently available from other sources?
• Novelty and Originality; does it propose a new and unique concept or expand on an existing premise from a unique point of view?
• Submissions are reveiwed anonymously
Please submit Abstracts for review using our online submission system.
The template files for PowerPoint presentations can be found here. The screen size is 16:9 widescreen.