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SIGNAL AND POWER INTEGRITY (SIPI 2017)

2017 IEEE International Conference on Signal and Power Integrity (SIPI 2017)
An embedded conference within the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity
Dates: August 7-11, 2017
Location: The Gaylord National Resort & Convention Center, National Harbor, Maryland

CALL FOR PAPERS

EMC and SIPI Call for Papers are now closed.
Please consider submitting an Abstract Reviewed Paper.

ABSTRACT REVIEWED CALL FOR PAPERS

INFORMATION FOR AUTHORS

2017 IEEE International Conference on Signal and Power Integrity (SIPI 2017) will be held as an embedded conference within the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity. Registered attendees will have access to the entire EMC Symposium program, in addition to the programs of SIPI 2017, without additional fees. As high-speed designs continue evolving, signal/power integrity and other EMC problems become tightly related to each other. Thus, the conference provides a unique opportunity for attendees to exchange ideas and share experiences relevant for today’s high-speed designs.

Join your colleagues and experts/innovators in Washington DC for a full week of technical presentations on advances and research works in EMC, SI, PI and other related fields. All papers that are accepted will be published in IEEE Xplore. In addition, authors of accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility. Proposals for special sessions, workshops, tutorials and experiments are also highly encouraged.

PAPER TOPICS OF INTEREST

Topics include and are not limited to EMC TC-10 Signal and Power Integrity and the following sample topics:

Interconnects
• High-speed interconnect design and optimization (component and/or system level)
• Interconnect modeling and extraction
• Channel analysis

Power Distribution Network and Decoupling
• PDN (power delivery network) design and optimization
• Design, analysis, simulation, modeling and measurement techniques

Chip level
• On-chip and off-chip high-speed signaling techniques
• 3-D IC and TSV

Tools and Methodologies
• Jitter/Noise/Crosstalk/BER budgeting, analysis, and measurement
• De-embedding method
• Time domain and frequency domain measurement techniques

Simulation and Modeling Techniques
• High-frequency and electromagnetic simulation techniques
• Simulation and measurement correlation
• Advanced simulation tools/algorithms
• Device modeling and characterization
• Multiphysics modeling for Analog/RF/MEMS/optical chip-package-systems
• Macromodeling and Model Order Reduction for Signal and Power Integrity

System Co-Design
• Signal/power integrity for chip/package/board/connector/cable design
• Signal integrity and power integrity co-analysis
• System-level SI/PI/EMI co-design

Others
• RF, microwave and mixed signal analysis

Please consider the 2017 Theme Topics:

Theme Topic I – EMC for Emerging Technologies

- Wireless EMC
- Radio-Frequency Interference
- Smart Grid EMC
- Nano-Materials and Silicon Photonics
- Unmanned Aircraft Systems EMC


Theme Topic II – Signal & Power Integrity

- High-speed channel characterization and modeling
- Signal/power integrity co-design and co-simulation
- 3D IC and 3D packaging
- Measurement techniques
- Jitter, equalization, BER


Theme Topic III – EMC and the Internet of Things

- Power Integrity
- Wireless & RF Spectrum Challenges/Solutions
- Medical Devices
- Smart Cities and Energy
- Tactics and topics for the next generation of device and system requirements




AUTHOR SUBMISSION SCHEDULE FOR PAPERS

• Preliminary Full Paper Manuscript: November 1, 2016 - January 16, 2017  January 23, 2017
(late papers will not be accepted)
• Acceptance Notification: February 21, 2017
• Final Paper Due: May 3, 2017
Please refer to the Call for Special Sessions and Call for Workshops/Tutorials for their respective submission schedules

PAPER FORMATS

• Traditional Oral presentation: Presentation for those interested in presenting to large groups with limited potential for interactions with attendees. Six-page paper maximum, 20 minute presentation with 10-minute question and answer session
• Open Forum: Presentation for those interested in direct interaction with individuals or small groups

STUDENT PAPER CONTEST

As part of the EMC Symposium, graduate and undergraduate authors are eligible for the Best Student Paper contest. The student must be the primary author and should indicate that they wish to be considered for the contest when submitting the preliminary manuscript. Each student’s professor will be asked to certify that the paper is primarily the work of the student.

SPECIAL ISSUE OF IEEE TRANSACTIONS ON EMC

Authors of accepted papers will be invited to submit an extended version of their conference paper for possible inclusion in a special issue of the IEEE Transactions on Electromagnetic Compatibility featuring papers from the 2017 IEEE International Symposium on EMC including SIPI 2017. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.

GUIDELINES FOR AUTHORS & SUBMITTAL PROCEDURES

Prospective authors must submit electronically**:

• A preliminary manuscript (4 – 6 pages) including all relevant results and conclusions
• Choice of presentation format (traditional oral or open forum)

** Preliminary Manuscripts and Final papers are to be submitted through a website after November 1, 2016. Check back with the conference web site for updates on the paper submission process. During the electronic submission process a unique author code is created for tracking purposes. Submissions are reviewed anonymously so please do not include author names or affiliations on the Preliminary Manuscript. Failure to do so may result in rejection.

PAPER ACCEPTANCE PROCEDURES & CRITERIA

• Importance of Topic: Does it have direct significance to the SI/PI/EMC community?
• Technical Sophistication and Depth: Does it present information that is a significant contribution, advancement, application or refinement of the state of the art? Does it expose the reader to a higher knowledge level than currently available from other sources? Is it clear that the work has been substantially completed or is the submission an interim report of progress on a long term project?
• Readability, Clarity and Presentation: Is the value of the submission clearly defined? Is the material written in clear and concise English, with topics presented in an organized and logical manner?
• Novelty and Originality: Does it propose a new and unique concept or expand on an existing premise from a unique point of view? Does it present new information on an SI/PI/EMC issue that is still in developmental stage?

DOWNLOAD THE SIPI CALL FOR PAPERS

PAPER SUBMISSIONS

The template files to be used for all paper submissions can be found here:

IEEE - MANUSCRIPT TEMPLATES

Please submit Preliminary Manuscripts and Final papers using our online submission system.

CLICK HERE TO SUBMIT PAPERS

POWERPOINT TEMPLATES

The template files for PowerPoint presentations can be found here. The screen size is 16:9 widescreen.

DOWNLOAD THE EMC+SIPI 2017 16:9 WIDESCREEN POWERPOINT TEMPLATE


SIPI 2017 General Co-Chairs
Jun Fan (jfan@mst.edu)
Antonio Orlandi (antonio.orlandi@univaq.it)

SIPI 2016 Technical Program Co-Chairs

Xiaoning Ye (xiaoning.ye@intel.com)
Erping Li (liep@zju.edu.cn)


Exhibit at EMC+SIPI 2017

Reserve your exhibit space now. Come be a part of the most concentrated gathering of EMC and SIPI professionals and managers in the world with close to a thousand attendees.

Download the EMC+SIPI 2017 Exhibitor Packet

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