EMC +SIPI 2017 SYMPOSIUM PROGRAM
The 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity Program is a comprehensive event featuring technical information, collateral industry meetings, professional awards, professional development, networking social events and companion events.
TECHNICAL SUBMISSION INFORMATION
There are many ways to participate and support the Symposium. The most common is to submit a technical paper, but one can also sponsor a workshop/tutorial or special session on a topic of interest, propose a hardware experiment or computer modeling demonstration, organize a collateral or technical meeting, working group and more.