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Bruce ArchambeaultBruce Archambeault

Dr. Bruce Archambeault is an IEEE Fellow, an IBM Distinguished Engineer Emeritus and an Adjunct Professor at Missouri University of Science and Technology. He chaired the 2014 IEEE EMC&SI Symposium in Raleigh. He is the author of the book “PCB Design for Real-World EMI Control” and the lead author of the book titled “EMI/EMC Computational Modeling Handbook.” He likes to sail and do woodworking.

Jun FanJun Fan

Jun Fan (S’97-M’00-SM’06-F’16) received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2000. From 2000 to 2007, he worked for NCR Corporation, San Diego, CA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), and is currently a Professor and Director of the Missouri S&T EMC Laboratory. Dr. Fan also serves as the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility and Senior Investigator of Missouri S&T Material Research Center. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. Dr. Fan served as the Chair of the IEEE EMC Society TC-9 Computational Electromagnetics Committee from 2006 to 2008, and was a Distinguished Lecturer of the IEEE EMC Society in 2007 and 2008. He currently serves as the Chair of the Technical Advisory Committee of the IEEE EMC Society, and is an associate editor for the IEEE Transactions on Electromagnetic Compatibility and EMC Magazine. Dr. Fan received an IEEE EMC Society Technical Achievement Award in August 2009.

Lee HillLee Hill

Lee Hill is Founding Partner of SILENT Solutions LLC, an independent electromagnetic compatibility (EMC) and RF design firm established in 1992. Besides providing EMC design review and troubleshooting services, Lee is a member of adjunct faculty at Worcester Polytechnic Institute (WPI), an EMC class instructor at the University of Oxford (England), and an EMC instructor for the IEEE EMC Society’s annual Global University program and EMC Fundamentals workshop. He has also served as an EMC instructor for UC Berkeley Extension, Hewlett-Packard, Agilent, Freescale Semiconductor, and General Motors University. Previously Lee was Principal EMC and Systems Engineer at Digital Equipment Corporation’s Workstation Systems Engineering Group in Palo Alto, California. Lee received the Master of Science Degree in Electrical Engineering & Electromagnetics with highest honors from the University of Missouri-Rolla EMC Laboratory, (now Missouri University of Science and Technology). Lee is a past member of the Society’s Board of Directors (2004-2007), and also served as a member of the Society’s Awards Committee. In 1994, Lee was appointed to serve a two year term as an IEEE EMC Society Distinguished Lecturer (DL), and from 1999-2006 he served as chair of the DL program.

Todd HubingTodd Hubing

Dr. Todd Hubing is a Professor Emeritus of Electrical and Computer Engineering at Clemson University and President of LearnEMC. Dr. Hubing holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer at IBM for 7 years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson University in 2006. As the Michelin Professor of Vehicle Electronics at Clemson, he established the Clemson Vehicular Electronics Laboratory where he supervised research projects and taught classes in vehicle electronics, electromagnetic compatibility and digital signal integrity. At LearnEMC, he provides EMC instruction, consulting and design assistance to engineers working in the automotive, aerospace and consumer electronics industries. Dr. Hubing has authored or co-authored over 200 papers and presentations on electromagnetic modeling, electromagnetic compatibility and the design of reliable electronic systems. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the Applied Computational Electromagnetics Society, and a Past-President of the IEEE Electromagnetic Compatibility Society.

Sourajeet RoySourajeet Roy

Sourajeet Roy received the B.Tech. degree from Sikkim Manipal University, Gangtok, India, in 2006, and the M.E.Sc. and Ph.D. degrees from Western University, London, ON, Canada, in 2009 and 2013, respectively, all in electrical engineering. Dr. Roy currently serves as an Assistant Professor with the Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA. His current research interests include modeling and simulation of high speed circuits, signal and power integrity analysis of electronic packages, and uncertainty quantification of microwave/ RF circuits. Dr. Roy is a recipient of the Vice-Chancellors Gold Medal at the undergraduate level in 2006, the Queen Elizabeth II Graduate Scholarship in Science and Technology in 2012, and the Ontario Graduate Scholarship in 2012. He currently serves as the reviewer for IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, IEEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY and IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I: REGULAR PAPERS. He also currently serves as the guest associate editor for IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY.

Madhavan SwaminathanMadhavan Swaminathan

Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author of 450+ refereed technical publications, holds 29 patents, primary author and co-editor of 3 books (Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007, Introduction to System on Package, McGraw Hill, 2008 and Design and Modeling for 3D ICs and Interposers, WSP, 2013), founder and co-founder of two start-up companies (E-System Design and Jacket Micro Devices) and founder of the IEEE Conference Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference on Signal and Power Integrity sponsored by the CPMT society. He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

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