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EMC CALL FOR PAPERS

EMC and SIPI Call for Papers are now closed.
Please consider submitting an Abstract Reviewed Paper.

ABSTRACT REVIEWED CALL FOR PAPERS

INFORMATION for Authors

Join your colleagues in Washington DC where you can share your insight, ask questions, learn from the experts/innovators and see new products at the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity. The IEEE EMC Society is seeking original, unpublished papers covering all aspects of electromagnetic compatibility, including EMC design, modeling, measurements and education. This year’s symposium includes the extremely popular embedded conference, 2017 IEEE International Conference on Signal and Power Integrity (SIPI 2017), featuring workshop, tutorials and technical sessions devoted to topics of interest to both EMC and Signal Integrity engineers.

Conference proceedings will be submitted for posting to IEEE Xplore. In addition, authors of accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility.

PAPER TOPICS OF INTEREST

Topics include and are not limited to the following technical areas (sample topics shown).
TC-1 EMC Management
• Personnel & Laboratory Accreditation
• EMC Education
• Legal Issues


TC-2 EMC Measurements
• Test Instrumentation & Facilities
• Measurement Techniques
• Standards and Regulations


TC-3 EM Environment
• EM Signal Environment
• Atmospheric & Man-Made Noise


TC-4 EM Interference
• Shielding, Gasketing & Filtering
• Cables and Connectors
• Circuit & System EMC Analysis
• Grounding


TC-5 High Power Electromagnetics
• ESD & Transients
• EMP, IEMI & Lightning
• Information Leakage
• Electric Power EMC


TC-6 Spectrum Engineering
• Spectrum characterization and modeling
• Design for spectrally efficient systems
• Adaptive interference mitigation


TC-7  Low Frequency EMC
• Power Quality and Conducted EMC
• Power Electronics


TC-9 Computational Electromagnetics
• Computer Modeling Methods
• Tools and Techniques
• Validation Methods
• Statistical Analysis


TC-10 Signal and Power Integrity (Embedded Conference SIPI 2017)
• High-Speed Interconnects
• Device Modeling & Characterization
• Crosstalk, Jitter, Noise Coupling, BER Analysis
• 3D IC & TSV
• Power Distribution Networks & Decoupling
• SI/PI/EMI Co-Design


TC-11 Nanotechnology & Advanced Materials
• Nanomaterials & Nanostructures
• Smart Materials


TC-12:  EMC for Emerging Wireless Technologies
• EMC Planning/Testing/Specifications
• Wireless Coexistence
• Intra-System Interference


SC1  Smart Grid EMC
• RF Environment
• Performance Degradation


SC5 Power Electronics EMC
• power electronics converters EMI/EMC issues
• switching frequency schemes
• inverters
• grid-connected PV systems, wind farms, automotive, aerospace, and communication systems.


SC6 Unmanned Aircraft Systems EMC
• Spectrum Management on Intra and Inter-System Interactions
• Design, Testing, Modeling/Simulation Required for System Level EMC for Unmanned Aircraft Systems
• Robust Performance in the Presence of High Intensity Radiated Fields (HIRF) 


SC7 Aeronautics and Space EMC
•EMI/EMC issues in aircraft, spacecraft & space launch vehicles, robotic and crewed
•EMC analysis, design, test and performance of space systems
•Part, board, box, system, multi-system, planetary and interplanetary levels
•Launch and space environments


Embedded Conference on Signal and Power Integrity (SIPI 2017)
• High-Speed Interconnects
• Device Modeling & Characterization
• Crosstalk, Jitter, Noise Coupling, BER Analysis
• 3D IC & TSV
• Power Distribution Networks & Decoupling
• SI/PI/EMI Co-Design


Please consider the 2017 Theme Topics:

Theme Topic I – EMC for Emerging Technologies

- Wireless EMC
- Radio-Frequency Interference
- Smart Grid EMC
- Nano-Materials and Silicon Photonics
- Unmanned Aircraft Systems EMC


Theme Topic II – Signal & Power Integrity

- High-speed channel characterization and modeling
- Signal/power integrity co-design and co-simulation
- 3D IC and 3D packaging
- Measurement techniques
- Jitter, equalization, BER


Theme Topic III – EMC and the Internet of Things

- Power Integrity
- Wireless & RF Spectrum Challenges/Solutions
- Medical Devices
- Smart Cities and Energy
- Tactics and topics for the next generation of device and system requirements




AUTHOR SUBMISSION SCHEDULE FOR PAPERS
• Preliminary Full Paper Manuscript:  November 1, 2016 - January 16, 2017  January 23, 2017
(late papers will not be accepted)
• Acceptance Notification: February 21, 2017
• Final Paper Due:  May 3, 2017

Please refer to the Call for Special Sessions and Call for Workshops/Tutorials for their respective submission schedules.
 
PAPER FORMATS
Traditional Oral presentation: Presentation for those interested in presenting to large groups with limited potential for interaction with attendees. Six-page paper maximum, 20-minute presentation with a 10-minute question and answer session
Open Forum: Presentation for those interested in direct interaction with individuals or small groups

STUDENT PAPER CONTEST
Graduate and undergraduate authors are eligible for the Best Student Paper contest. The student must be the primary author and should indicate that they wish to be considered for the contest when submitting the preliminary manuscript. Each student’s professor will be asked to certify that the paper is primarily the work of the student.  A Student Design Contest is also being held. Obtain the design kit, rules and award details from this website (coming soon!)

SPECIAL ISSUE OF IEEE TRANSACTIONS ON EMC
Authors of accepted papers will be invited to submit an extended version of their symposium paper for possible inclusion in a special issue of the IEEE Transactions on Electromagnetic Compatibility, featuring papers from the EMC+SIPI 2017. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.

GUIDELINES FOR AUTHORS & SUBMITTAL PROCEDURES 
Prospective authors must submit electronically**.
• A preliminary manuscript (4 – 6 pages), including all relevant results and conclusions
• Choice of presentation format (traditional oral or open forum)

** Preliminary Manuscripts and Final papers are to be submitted using the link provided on the symposium website at www.emc2017.emcss.org after November 1, 2016.  During the electronic submission process a unique author code is created for tracking purposes. Submissions are reviewed anonymously, so please do not include author names or affiliations on the Preliminary Manuscript. Failure to comply with submission requirements may result in rejection.

 PAPER ACCEPTANCE PROCEDURES & CRITERIA
• Importance of Topic: Does it have direct significance to the EMC community?
• Technical Sophistication and Depth: Does it present information that is a significant contribution, advancement, application or refinement of the state of the art?
   Does it expose the reader to a higher knowledge level than currently available from other sources?
• Readability, Clarity and Presentation: Is the value of the submission clearly defined? Is the material written in clear and concise English, with topics
   presented in an organized and logical manner?
• Novelty and Originality: Does it propose a new and unique concept or expand on an existing premise from a unique point of view?
• Submissions are reviewed anonymously

DOWNLOAD THE CALL FOR PAPERS PDF


PAPER SUBMISSIONS

The template files to be used for all paper submissions can be found here:

IEEE - MANUSCRIPT TEMPLATES


Please submit Preliminary Manuscripts and Final papers using our online submission system.

CLICK HERE TO SUBMIT PAPERS

POWERPOINT TEMPLATES

The template files for PowerPoint presentations can be found here. The screen size is 16:9 widescreen.

DOWNLOAD THE EMC+SIPI 2017 16:9 WIDESCREEN POWERPOINT TEMPLATE

Exhibit at EMC+SIPI 2017

Reserve your exhibit space now. Come be a part of the most concentrated gathering of EMC and SIPI professionals and managers in the world with close to a thousand attendees.

Download the EMC+SIPI 2017 Exhibitor Packet

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