CALL FOR PAPERS
INFORMATION for Authors
Join your colleagues in Washington DC where you can share your insight, ask questions, learn from the experts/innovators and see new products at the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity.
The IEEE EMC Society is seeking original, unpublished papers covering all aspects of electromagnetic compatibility, including EMC design, modeling, measurements and education. This year’s symposium includes the extremely popular embedded conference, 2017 IEEE International Conference on Signal and Power Integrity (SIPI 2017), featuring workshop, tutorials and technical sessions devoted to topics of interest to both EMC and Signal Integrity engineers. Conference proceedings will be submitted for posting to IEEE Xplore. In addition, authors of accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility.
EMC and SIPI Call for Papers are now closed.
Please consider submitting an Abstract Reviewed Paper.
ABSTRACT REVIEWED CALL FOR PAPERS
SPECIAL SESSIONS CALL FOR PAPERS
WORKSHOPS & TUTORIALS CALL FOR PAPERS
HARDWARE EXPERIMENTS & DEMONSTRATIONS
COMPUTER MODELING & SIMULATIONS DEMONSTRATIONS
The template file for presenters can be found here. The screen size is 16:9 widescreen.
DOWNLOAD THE EMC+SIPI 2017 16:9 WIDESCREEN POWERPOINT TEMPLATE
Exhibit at EMC+SIPI 2017
Reserve your exhibit space now. Come be a part of the most concentrated gathering of EMC and SIPI professionals and managers in the world with close to a thousand attendees.
Download the EMC+SIPI 2017 Exhibitor Packet