The 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity is a solely sponsored event by the IEEE Electromagnetic Compatibility Society (EMC-S). The EMC-S has formed the 2017 Committee to organize and sponsor the event. This committee also relies on additional volunteer support from many other members of the EMC Society. Additionally, there are many companies that are involved in support of our event. To clarify their association with this event, please see our Advertising Disclaimer.

WHO IS THE EMC SOCIETY?

The IEEE Electromagnetic Compatibility Society is the world’s largest organization dedicated to the development and distribution of information, tools and techniques for reducing electromagnetic interference.

 

The society’s field of interest includes standards, measurement techniques and test procedures, instrumentation, equipment and systems characteristics, interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional or other activities that contribute to this field.

 

IEEE EMC Society Mission

To foster the development and facilitate the exchange of scientific and technological knowledge in the discipline of electromagnetic environmental effects and electromagnetic compatibility, as detailed in the EMCS’s field of interest (FOI), and promote literary, educational and professional aspects thereof, that benefit members, the profession and humanity.

 

IEEE EMC Society Vision

To be the recognized and respected global organization and leading provider of scientific and engineering information and services in the field of electromagnetic environmental effects and electromagnetic compatibility engineering, technology, and innovation for the betterment of society and the preferred professional development source for our members.

 

IEEE EMC Society Field of Interest Statement

The Field of Interest of the Society involves engineering related to the electromagnetic environmental effects of systems to be compatible with themselves and their intended operational environment. This includes: standards, measurement techniques and test procedures, instrumentation, equipment and systems characteristics, interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional or other activities that contribute to this field.

For more information go to the EMC Society website.

COMMITTEE MEMBERS

EMC+SIPI 2017 COMMITTEE MEMBERS

GENERAL CHAIR 

Mike Violette

VICE GENERAL CHAIR

Steve Ferguson

MARKETING CHAIR

Bob Davis

CONFERENCE MANAGEMENT

John Vanella

CHAIR, TRADE SHOW & EXHIBITS

Mark Maynard

CHAIR, COMPANION PROGRAM

Sue Archambeault

SECRETARY

Dana Craig

CHAIR, FINANCE & TREASURER

John LaSalle

CHAIR, PUBLICATIONS

John Rohrbaugh

WEBSITE/DESIGN

Kelly Scott-Olson

CHAIR, ARRANGEMENTS

Rhonda Rodriguez

VICE CHAIR, ARRANGEMENTS

Dennis Lewis

CHAIR, REGISTRATION

Bonnie Brench

CHAIR, SOCIAL EVENTS

Caroline Chan

CO-CHAIRS, VOLUNTEERS

Alpesh Bhobe
Stephen Scearce

PLANNING SUPPORT

Jim Baer
Tom Boughner
Mark Chandler
Al Frye
Fred Heather
Theresa Kerrick
Joseph Phan Nghiem
Mike Oliver
Ricgard Reitz
Guiseppe Selli
Jeffrey Silberberg

EMC 2017 TECHNICAL COMMITTEE MEMBERS

CHAIR, TECHNICAL PROGRAM

Bruce Archambeault

VICE CHAIR, TECHNICAL PROGRAM

Alistair Duffy

CHAIR, TECHNICAL PAPERS

Charles Bunting

CO-CHAIRS, TECHNICAL PAPERS – EMERGING NEW TECHNOLOGIES

Brice Achkir
Yihong Qi

CHAIR, WORKSHOPS & TUTORIALS

John Maas

CHAIR, YOUTH PROGRAM

Steven Koster

CO-CHAIRS, EXPERIMENTS AND DEMONSTRATIONS

Bob Scully
Sam Connor

CO-CHAIRS, SPECIAL SESSIONS

Colin Brench
Chunfei Ye

CHAIR, GLOBAL UNIVERSITY

Dale Becker

SIPI 2017 COMMITTEE MEMBERS

CO-CHAIRS, GENERAL CHAIR, SIPI

Jun Fan
Antonio Orlandi

CO-CHAIR,TECHNICAL PROGRAM COMMITTEE, SIPI

Xiaoning Ye
Erping Li

EMC+SIPI ONLINE SYMPOSIUM

DIGITAL SYMPOSIUM CHAIR

Jay Diepenbrock

DIGITAL SYMPOSIUM EVENT LEAD

Graham Kilshaw

DIGITAL SYMPOSIUM EVENT TEAM

Geoff Forman
Erica Osting
Michele Stankunas

2017: IEEE International Symposium on EMC, SI & PI

August 7-11: Washington DC
Mike Violette, 240.401.1388

2018: Joint IEEE International Symposium on EMC and APEMC

May 14-17: Singapore
Liu Enxiao, liuex@ihpc.a-star.edu.sg
Er Ping Li, erpingli@ieee.org

2018: IEEE Symposium on EMC, SI & PI

July 30 – August 3: Long Beach, California
Ray Adams, r.k.adams@ieee.org

2019: IEEE Symposium on EMC, SI & PI

July 22-26: New Orleans, Louisiana
Dennis Lewis, dennis.m.lewis@boeing.com

2020: IEEE Symposium on EMC, SI & PI

July 27-31: Reno, Nevada
Darryl Ray, darrylr16@yahoo.com

OUR VALUED SPONSORS & PARTNERS

Industry Sponsor

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